Which is good for fully automatic chemical mechanical polishing

summary:

The RTEC chemical mechanical polishing machine CP-6 adopts a professional approach to study and characterize the CMP process. In addition to polishing wafers and substrates, the tester is also equipped with an online surface profilometer. This combination provides information about the reasons and ways in which surface, friction, wear, and other changes occur. The tester can also measure several inline parameters, such as friction, surface roughness, wear, etc., in order to gain a detailed understanding of the process.

Features:

1. Integrated confocal 3D microscope that can characterize polishing pad surfaces with nm resolution;

2. Research on inline friction and acoustic emission polishing process;

3. Inline temperature sensor;

4. Can install multiple wafer sizes;

5. Controllable downforce and speed.

The standard configuration includes X and Y platforms, which can move the pressure plate between polishing and imaging positions. In addition, the XY platform helps to oscillate the wafer during the polishing process. Using a pressure plate with XY drivers allows for multi axis drive combinations to create custom movements that simulate testing conditions close to real-world production environments.

Inline sensor:

1. Torque - High resolution inline torque sensor can achieve endpoint positioning and real-time characterization of the surface;

2. Acoustics - Sound signals that allow for qualitative endpoint or assist in detecting fragments and defects during the polishing process;

3. Online temperature monitoring of the solder pads and areas near the polished surface of the wafer helps to study the removal mechanism.

Programmable load, speed:

In order to optimize the process, CP-6 allows the use of formula based software to control and change force, speed, and flow rate.

Easy to use

The friction measuring instrument is equipped with a quick change carrier, which can easily install wafers and solder pads. The software comes with pre-defined test standard formulas or allows for easy creation of new custom formulas.

Integrated online 3D profilometer:

The Rtec chemical mechanical polishing machine is equipped with an inline integrated 3D profilometer. After optimization, the polishing pad surface with nm resolution can be characterized. The detector is equipped with confocal mode+interferometer mode+dark field and bright field modes. This allows for the study of the relationship between surface changes and time at nm resolution. This tester allows for self stitching on a large surface area for volumetric wear and roughness calculations.