Which is a good fully automatic chemical mechanical polishing machine

NegotiableUpdate on 04/22

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

From the perspective of small-scale laboratory economy, the Rpo-6 chemical mechanical polishing machine is used to develop CMP process flow and replace polishing chips. Its high flexibility can polish any material. Process flow and transportation of consumables for in-situ friction and polishing pad wear measurement with replaceable probes to meet 6-inch chip standards

Product Details

Rpo-6 typeChemical mechanical polishing machineMain Features

technology

Chemical mechanical polishing (CMP) is a process used to flatten chips or other materials during processing, and polishing technology utilizes the synergistic effect of physics and chemistry to polish chips. It is achieved by applying a loading force to the base of the sample stored in the polishing pad. When the polishing solution containing both abrasives and active chemicals passes through the bottom, the polishing pad and sample begin to count and rotate.

In-situ friction

This instrument studies basic polishing techniques by measuring in-situ friction and wear, while changes in friction can be used to approximate removal rates.

In situ gasket wear

The in-situ wear rate can be used to reflect the state of the gasket under polishing, adjustment, and other conditions.

state

In situ and non in situ regulation

chip size

The easily replaceable chip fixture can polish samples ranging in size from 1 inch to 6 inches on the same tester.

pump

Independent programmable pumps can provide mud, water, and other chemical products.

Consumables and related consulting

The standard polishing materials we provide not only include instruments but also a range of consumables such as polishing fluid and pads. At the same time, our scientific team will also provide you with consulting services on process development and optimization.

Rpo-6 typeChemical mechanical polishing machineSpecifications

Artificial chip loading

Desktop CMP development system

In situ and non in situ regulation

Mud and water pipes using programmable pumps

High hardness and good force control

340mm drum diameter

6-inch sample

In situ friction and gasket wear selection

Printing size w870x, d800x, h870mm

Application - CMP, MEMS, consumables testing

application