Dust free and oxygen free oven manufacturer

Intelligent dust-free anaerobic oven (PI curing anaerobic oven)Applied to special process requirements for precision electronic components, PI, BCB adhesive high-temperature curing baking, silver adhesive curing, photoresist curing, and dust-free drying of electronic ceramic materials. Suitable for industries such as touch screens, wafers, LEDs, PCB boards, ITO glass, precision electronics, solar energy, new materials, etc

Intelligent dust-free anaerobic oven (PI curing anaerobic oven)Inner box size specifications:

customizable

W350mm×350mm×H350mm

W450mm×450mm×H450mm

W500mm×500mm×H500mm

W500mm×600mm×H700mm

Temperature range:

RT+50～400/500℃

Temperature resolution:

0.1℃

Temperature fluctuation:

≤±1℃

Temperature uniformity:

≤±1.5%℃

Cleanliness:

Class100 (optional Class1000)

heating rate

1-10 ℃/min, (customizable to 15 ℃/min)

降温速率：

High temperature cooling to 80 degrees, with an average of about 4.0 ℃/min (optional linear cooling)

Oxygen content:

Oxygen content ≤ 20ppm

Data output:

Oxygen content analyzer, six point temperature recorder

Operation method:

Human computer interface+PLC, programmable/customizable operation

Introduction to Vacuum Oxygen Free Oven and High Temperature Oxygen Free Vacuum Oven
Vacuum anaerobic oven is a special process equipment that provides high temperature, low oxygen, and clean environment. The interior of the oven is made of stainless steel structure and is entirely made of dust-free materials. The box can be filled with nitrogen and vacuum to keep the working chamber of the oven in a low oxygen and clean state. The temperature inside the studio is automatically controlled by a temperature controller, and there are automatic constant temperature and time control devices for curve heating, constant temperature, and rapid cooling. And it is equipped with over temperature disconnect heating, oxygen content detection, auxiliary cooling device and alarm circuit, with reliable control and safe use.
Vacuum anaerobic oven is used for special processes such as PI adhesive, BCB adhesive curing, bonding material pretreatment, ITO film annealing, PR adhesive extrusion curing, etc. Suitable for production and research departments such as electronic liquid crystal displays, LCDs, CMOS, ICs, PCB boards, semiconductor packaging, pharmaceuticals, laboratories, etc.
Technical parameters of vacuum anaerobic oven and high-temperature anaerobic vacuum oven
Temperature range: RT (room temperature)+50~+200/300/400/500 ℃;
Temperature fluctuation: ≤± 1 ℃
Heating rate: 0-10 ℃/min;
Cooling method: natural cooling or air cooling+water cooling cooling
Nitrogen Control: Electromagnetic Valve+Adjustable Flow Meter Control
Oxygen content detection: The oxygen concentration detector can reach 20ppm
Working size:

W350×H350×D350

W450×H450×D450

W600×H600×D600

customizable